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Showing 1–12 of 43 recalls
Potential for detachment of ceramic tip due to manufacturing without the designated amount of adhesive.
Potential for detachment of ceramic tip due to manufacturing without the designated amount of adhesive.
Potential for detachment of ceramic tip due to manufacturing without the designated amount of adhesive.
Potential for detachment of ceramic tip due to manufacturing without the designated amount of adhesive.
Due to product that may contain a void in the material that separates the wire guide and cutting wire lumens, which may cause an inappropriate path of current during cutting.
Devices which did not undergo thermoforming could deform and lose performance.
Devices which did not undergo thermoforming could deform and lose performance.
Devices which did not undergo thermoforming could deform and lose performance.
Devices which did not undergo thermoforming could deform and lose performance.
Devices which did not undergo thermoforming could deform and lose performance.
Devices which did not undergo thermoforming could deform and lose performance.
Devices which did not undergo thermoforming could deform and lose performance.